Intel’s 10 biggest projects around the world—including in Ohio
Image: Intel - Ohio groundbreaking
In Ohio, construction is well underway on Intel’s newest U.S. site in more than 40 years, the company said while sharing an update of progress at its 10 biggest projects around the world.
Around the world throughout 2023, Intel used 145,000 tons of steel and poured more than 2 million cubic yards of concrete - 32X more than for New York’s Empire State Building - to construct and expand its new facilities.
“Intel’s global manufacturing network is foundational to our operational success as we build a resilient, trusted and sustainable supply chain for the entire industry,” said Keyvan Esfarjani, executive vice president and chief global operations officer at Intel. “We must continue to invest in the future and plan for success to support the expected increase in long-term semiconductor demand around the world.”
Apart from the $28 billion project in Ohio, Intel’s largest projects around the world include developments in Arizona, New Mexico, Oregon, Ireland, Israel, Magdeburg, Penang and Kulim in Malaysia, and Poland.
You can read the full report here.
Intel’s Ohio Investment
Intel broke ground on two new chip factories in New Albany, just outside of Columbus, in September 2022. The initial phase is expected to create 3,000 Intel jobs, 7,000 construction jobs and about 10,000 indirect jobs.
Highlights in Ohio include:
More than 248,000 dump trucks full of dirt moved
More than 4 million cubic yards of earth moved over the past year, equal to about 248,000 dump truck loads
Teams installed 10 miles of underground utilities and 32 miles of conduit
In 2024, Intel continues to build out the new fab’s above-ground utility level. It has begun receiving superloads (extremely large truck loads of manufacturing equipment) that travel from southern Ohio to the Intel Ohio One campus in New Albany.
Intel announced in March it would receive $8.5 billion in direct funding through the CHIPS and Science Act, including for its Ohio project.
