Auxilium Health raises $1.5 million pre-seed round to advance breakthrough wound care treatment
Isaiah Kaiser, CEO of Auxilium Health
Cleveland-based HealthTech startup Auxilium Health announced this week it has closed an oversubscribed $1.5 million pre-seed funding round—surpassing its original $1.2 million goal. The company targets the major wound care market with regenerative infection-fighting technology.
Auxilium Health also announced an additional $275,000 grant from the National Science Foundation (NSF). The investment highlights growing confidence from both investors and the government in the company’s advanced biomaterial platform, which is designed to predict and prevent skin tissue infections in patients with chronic wounds.
Why it matters
More than 6.5 million Americans suffer from non-healing wounds each year, costing the U.S. healthcare system over $50 billion. Auxilium Health’s technology, developed by Chief Technology Officer Dr. Aparna Agrawal at the University of Akron, is engineered to accelerate skin regeneration while reducing the risk of infection—an approach that could transform wound care treatment.
The details
The $1.5 million round was backed by regional investors across Ohio and beyond—specific investors were not disclosed
The $275,000 NSF grant provides national validation of Auxilium’s scientific approach
Funding will support critical product development milestones, strategic growth, and clinical partnership expansion
What they’re saying
“This funding underscores confidence in our biomaterial platform and validates our proactive approach—developing breakthrough solutions that prevent and predict skin tissue infections,” said Isaiah Kaiser, CEO of Auxilium Health.
What’s next
With early traction in the BioTech space and growing national interest, Auxilium Health will focus on expanding R&D efforts, refining its platform for commercial use, and pursuing strategic healthcare partnerships to bring its infection-fighting materials to market.
For more information visit www.auxiliumhealth.xyz.